Inventors from the Center for Lighting Enabled Systems & Applications (LESA) at Rensselaer Polytechnic Institute were recently awarded a U.S. Patent entitled, “Light Emitting Diodes and a Method of Packaging the Same”.   The patent (US 9,245,875) describes how magnets can be used to arrange arrays of LED dies in a desired pattern and connect them to their substrate.  According to Professor Robert Karlicek, the Director of LESA, “Assisted LED self-assembly technology has the potential to radically reduce the cost of manufacturing large LED assemblies.”